Kim, Wonho 사진
Kim, Wonho
Chemical and Biochemical Engineering Major


Polymer Engineering
 Research Interests

Physical Properties and Mechanics of Rubbery Materials

Polymeric Composite Materials

Epoxy Resin Application

Ph.D., University of Akron, U.S.A., 1992
 Selected Publications 
  1. Wonho Kim, Sang Kwon Kim, Jong-Hyub Kang, Youngsun Cheo, and Young-Wook Chang
"Structure and Properties of the Melt Compounded NR/BR Nanocomposites" Macromolecular Research 14 (2), p 187-193, 2006.

2. Minyoung Kim, Wonho Kim, Insuh Park, and Byungsun Hwang
"Fracture Toughness of the Epoxy/ATPEI-CTBN-ATPEI Triblock Copolymer/NMA Blend System"
Composite Interfaces, 13 (2-3), p 189-204, 2006.

3. Seungchul Hwang, Minyoung Kim, Donghyeon Kim, Youngsun Cheo and Wonho Kim,
"Cure Kinetics and Mechanical Properties of New Polyetherimide Toughened Epoxy Resin"
Journal of Chemical Engineering of Japan 38 (8), p 623-632, 2005.

4. Bae, J.-W., Kim, W., Cho, S.-H., and Lee, S.-H., "The Properties of AlN-Filled Epoxy Molding Compounds by the Effects of Filler Size Distribution," Journal of Materials Science, Vol. 35, No. 23, pp. 5907-5913, 2000.

5. Kim, W., Bae, J.-W., Choi, I.-D., and Kim, Y.-S., "Thermally Conductive EMC(Epoxy Molding Compounds) for Microelectronic Encapsulation," Polymer Engineering and Science, Vol. 39, No. 4, pp. 756-766, 1999.
 Professional Experiences 

Staff Scientist, SAMSUNG Advanced Institute of Technology, Korea (1993-1994)

Research Engineer, Agency for Defence Development, Korea (1979-1986)

 Professional Societies & Activities 

Senior Member, The Korea Institute of Rubbery Industry
 Honors and Awards 

 International Joint Research & Activities